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Investigating the joining of incompatible materials and selection of effective diffusion barriers are one of the major challenges of device manufacturing in electronic industry.
Assembling of some functional materials becomes slightly more complicated since they are designed to work at high temperatures and might overcome various phase changes even during conventional joining. Hence, suitable low-temperature joining methods are needed to reliably integrate temperature limited thermoelectrics into engineering structures, i.e. thermoelectric modules (TEM) or generators (TEG).
Innovative joining of mid-temperature thermoelectric devices is being developed under the ‘Advanced Glasses, Composites and Ceramics for High Growth Industries (CoACH)’ project funded by the Horizon 2020 framework program, tasked with developing cutting-edge joining and assembling process of incompatible and relatively problematic elements into a module, i.e. thermoelectric material, metallic electrode and ceramic substrate.
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