Height tolerance 0.02mm, match in groups of 8, E1 material, epoxy sealed

Features

• Custom designs available

• Compatible with all modules using a heat sink bonder

• Operates up to 150°C continuously, 200°C short term

• Various finishes tailored to specific environments

• Standard models fit many pellet geometries

• Delivers up to 76°C ΔT performance

• Single-stage modules support cooling from a few mW to hundreds of Watts

• Mini modules cool IR chips, microwave ICs, and fiber-optic lasers