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Specification
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Features
• Sealed & lapped for multi-module applications • RoHs and Reach 161 compliant • Solid-state reliability • All types of modules can be bonded using heat sink bonder • Built with high temperature solder with the ability to withstand <200°C assembly processing temperatures for short periods of time • High strength for rugged environments • High integrity nickel diffusion barriers on elements • Max. delta T performance up to 76°C • Single-stage modules can create systems which are effective from a few mW to few hundred Watts of cooling power • Porched style for enhanced leadwire strength • Bespoke designs available
Liquid to Air Adaptive Thermoelectric Assembly
Direct to Air Adaptive Thermoelectric Assembly