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Specification
1+: £71.73
Price break discounts
Features
• Sealed & lapped for multi-module applications • RoHs and Reach compliant • Solid-state reliability • All types of modules can be bonded using heat sink bonder • Built with high temperature solder with the ability to withstand <200°C assembly processing temperatures for short periods of time • High strength for rugged environments • High integrity nickel diffusion barriers on elements • Max. delta T performance up to 76°C • Single-stage modules can create systems which are effective from a few mW to few hundred Watts of cooling power • Porched style for enhanced leadwire strength • Bespoke designs available
ETH-071-14-25-S-H1, 20W, High Temperature Thermoelectric Cooler Module
ETH-071-10-13-E-H1 (S20), 18W, High Temperature Thermoelectric Module
ETH-049-10-15-S-H1, 11.5W, 3.2A, High Temperature Thermoelectric Cooler Module
ETH-288-10-13-E-H1, High Temperature Thermoelectric Module, Epoxy Sealed, 78W
APHC-287-10-13-E