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Specification
TOTAL: £52.63
Price break discounts
Features
• Sealed & lapped for multi-module applications • RoHs and Reach compliant • Solid-state reliability • All types of modules can be bonded using heat sink bonder • Built with high temperature solder with the ability to withstand <200degreesC assembly processing temperatures for short periods of time • High strength for rugged environments • High integrity nickel diffusion barriers on elements • Single-stage modules can create systems which are effective from a few mW to few hundred Watts of cooling power • Bespoke designs available
Liquid to Air Adaptive Thermoelectric Assembly
Direct to Air Adaptive Thermoelectric Assembly