ETL Expertise

  • Heat Management Solutions: We specialise in providing innovative and efficient thermoelectric solutions designed to effectively dissipate heat from electronic components. Our solutions are tailored to the specific requirements of your products, ensuring they operate within safe temperature limits. 
  • Collaborative Design: ETL works closely with leading household brands from the initial concept and design phases. We understand the unique challenges each product may present and tailor our solutions to seamlessly integrate into your designs, optimising both performance and aesthetics. 
  • Component Supply: Beyond design and consultation, ETL is your trusted source for high-quality thermoelectric components. We supply the necessary hardware to implement our solutions, ensuring a streamlined and hassle-free integration process. 

Consumer Products Overview

At European Thermodynamics Limited (ETL), we recognise the crucial significance of managing and controlling heat in electronic hardware for consumer products. Whether it’s your state-of-the-art gadgets, household appliances, or any other consumer electronics, maintaining optimum temperature levels is not only vital for the longevity and performance of these devices but also paramount for ensuring the safety of end-users. With a rich history of collaboration with some of the most renowned household brands, ETL has firmly established itself as a trusted partner in the realm of thermoelectric solutions for consumer products. 

Case Studies

4G LTE telecommunications

European Thermodynamics (ETL) was approached by a major global provider of 3G/4G LTE and backhaul mobile telecommunications products to enhance the thermal performance of their equipment’s chassis. This task presented a significant challenge due to the equipment’s potential power output of up to 60W. Embedded fan cooling was not a feasible solution, necessitating the removal of heat through natural convection and conduction cooling methods. To address this challenge, we reevaluated the material initially proposed by the customer and explored alternative materials that could better serve our objectives. 

Our client required not only thermal design and analysis but also the production of a prototype and the supply of a component for their system. The existing design underutilized its capacity, resulting in inefficient heat distribution across the product. 

The Result: 

To meet cost targets and enhance thermal heat dissipation capabilities, we proposed a transition to an alternative material composition suitable for die-casting while maintaining improved heat transfer performance. A356 die-cast material, with typical thermal conductivity figures of 160W/m·K, emerged as the ideal choice. Our computational fluid dynamics (CFD) modelling team meticulously defined the optimized enclosure geometry for both vertical and horizontal positions. In collaboration with a die-casting partner, we conducted a design for manufacture (DFM) study post-CFD modelling to optimize the assembly for high-pressure die-casting. 

In the initial T0 phase, we overcame challenges related to anodization application by employing a fine electro-plated coating to blacken the case, facilitating maximum radiative heat exchange. Following minor adjustments in the T1 and T2 tooling phases, the product was successfully launched. It set a new standard in the client’s market by achieving increased output power while relying solely on passive cooling through chassis contact points. This significantly increased the mean time between failures (MTBF) of the total system assembly, setting a new benchmark in die-cast material product design. 

Currently, our materials science engineering team is conducting ongoing research to further enhance the capabilities of the A356 material, pushing its thermal conductivity closer to 180W/m·K. 

The final prototype, ready for tooling, represents the culmination of our efforts in addressing this thermal challenge. 

High Temperature Fans

The Challenge: 

European Thermodynamics faced a unique challenge involving an automotive headlamp application where the LED’s heat output could reach a staggering 150 degrees Celsius without any thermal management assistance. Additionally, cold-start and frost conditions posed efficiency issues for the LED’s until a pre-warm up of the components could be initiated. The project’s objective was to ensure that the LED circuit could operate effectively across a wide temperature range, from -20 to +120 degrees Celsius. 

Our Approach: 

Initially, we divided the challenge into two parts. We began by modelling the headlamp system using Ansys CFX and Solidworks CFD software to establish a theoretically known thermal performance before proceeding to develop thermal management solutions. 

The Result: 

On the cooling side, we collaborated with a leading cooling fan manufacturer to jointly create a 40mm x 40mm x 28mm deep fan model. This fan featured a modified ball bearing system capable of continuous operation within an ambient temperature of +120 degrees Celsius. The bill of materials (BOM) included various ‘uprated’ components and circuitry designed to withstand the harsh environment. The new fan model underwent rigorous environmental chamber tests conducted by the customer to verify its expected critical lifetime. 

Acoustic noise was also a primary consideration. Our thermal modeling engineers designed a high-performance, die-cast heatsink assembly using A356 material with a thermal conductivity of 160W/m·K. This assembly incorporated T-Global’s silicone-free thermal putties between the device and heatsink. This not only enhanced cooling performance but also aimed to maintain minimal acoustic noise output within the system. This reduction in overall broadband noise and the shift of pure tone frequencies to an acceptable level were key achievements. 

Regarding the pre-warm up of the LED’s, we are presently in the process of securing patents and intellectual property acknowledgments for the innovative methods and technology employed. This will lead to the development of a new product that automotive engineers can leverage to address potential ‘cold start’ issues effectively. 

The new high-temperature fans are now available for ordering, with minimum order quantities applicable. 

View case study

Coolpower

The Challenge: 

A German-based automotive infotainment company reached out to European Thermodynamics seeking support for their in-house thermal management team. They encountered challenges where specific aspects of the thermo-mechanical case design failed to maintain the required stable operating temperature when integrated into the dashboard environment of their vehicles. The problem encompassed structural rigidity, vibration, material considerations for thermal performance, cost efficiency, and the feasibility of high-volume manufacturing. 

Our Approach: 

Our engineering team initiated the investigation by thoroughly defining the problem, addressing structural and material concerns, and considering the demands of the high-volume manufacturing process. Computational Fluid Dynamics (CFD) modelling and analysis were instrumental in guiding our approach. 

The Result: 

The thermal modelling team embarked on the project and devised a relatively simple heatsink construction using AL6063 (T6 hardened) aluminium material. However, the key to effectively cooling the devices lay in the development of a specialized heatpipe, complete with its fluidic and condensing core structure, which was integrated into the heatsink. To further enhance thermal conductivity “thru Z axis,” we enlisted the support of the chemistry team within T-Global Technology, who formulated a specific silicon-free thermal gel. 

The resulting heatsink assembly adopted a passive approach, offering the advantages of a robust, acoustically noise-free thermal solution. This assembly is now in mass production and successfully aligns with the financial budget set for the thermal components. 

Coolpower represents a significant achievement in enhancing automotive infotainment thermal management, providing efficient cooling solutions for the challenging dashboard environment of modern vehicles. 

View case study

Enterprise router

The Challenge: 

Our client approached European Thermodynamics with a complex issue involving overheating Ball Grid Array (BGA) devices integrated into a series of vertical PCBs housed within a 60U tall, 19-inch rack. The combined heat output from these components amounted to 2 kW. However, liquid cooling was not a viable option, as stakeholders within the project deemed water or any other form of liquid to pose a high risk in the rack’s operating environment. 

Upon initial assessment, it became evident that the cabinet had undergone multiple revisions, rendering the original design inadequate for the latest specifications. Both the mainboard heatsink and the forced convection strategy required a comprehensive re-evaluation. 

The Result: 

Our thermal modelling team initiated the project by conducting preliminary baseline performance investigations to establish a reference point for subsequent solutions. This posed a challenging and engaging problem, as the forced convection and heatsink design were concurrently developed, with each significantly impacting the other. Therefore, project plans and milestones for system design reviews with the client were of paramount importance. Support and requests for subtle mechanical adjustments to the cabinet were necessary to balance inlet and outlet pressure drops while adhering to specific venting patterns. 

Our team collaborated with our fan manufacturing partner to develop a custom fan designed to meet the required PQ (Pressure-Volume) operating curve for the ‘tuned’ pressure drop across the newly designed heatsink configuration. Adjustments were made to the fan venturi depth, impellor blade pitch, and exhaust pattern to achieve the optimal PQ output and acoustic frequency. Given that 16 fans were arranged in a planar array, addressing acoustic noise concerns was crucial. We employed noise-reducing techniques, including acoustic baffling, gasketing, and precise positioning of the fans within the planar array to optimise the interaction between each fan’s influence. 

The heatsink was eventually optimised for manufacturing as a two-piece ‘jigsaw pattern’ heatsink that spanned the entire length of the board. Heat risers were incorporated with a specific arrangement of independent suspension push-pin configurations. These enhancements facilitated the application of ‘TG-X’ thermal interface material (12W/m·K) and provided the necessary 30% deflection on the pads. 

Vertical velocity fields were used to illustrate the general airflow pattern, while a Computational Fluid Dynamics (CFD) model was employed to simulate the prototype, ensuring comprehensive analysis and optimisation. 

Outcomes

  • Proven Track Record: Our extensive experience in the industry speaks for itself. We have a track record of successful collaborations with household brands, helping them bring reliable and efficient consumer products to market.
  • Cutting-Edge Technology: ETL remains at the forefront of thermoelectric technology, continually innovating to provide you with the most advanced solutions available. We stay updated with the latest trends and emerging technologies to keep your products competitive.
  • Safety First: We understand that consumer safety is paramount. Our solutions not only enhance the performance of your products but also ensure they meet safety standards and regulatory requirements.
  • Customised Solutions: Every consumer product is unique, and we treat it as such. Our solutions are customised to fit the specific needs and constraints of your project, ensuring optimal results.