Products / Thermal Interface Materials / Gap Filler Pads / Sheets / Silicone Thermal Interface Material, 2.0W/m.K
Silicone Thermal Interface Material, 2.0W/m.K
GCSP-20
Features
- High hardness score of 50 (Shore OO)
- Good thermal conductivity
- Single side adhesive
- Long term stability
- Electrical insulation
Specifications
| Thermal conductivity W/m.K |
2 |
| Hardness |
50 |
| Thickness mm |
0.5-3.0 |
| Single / Double side adhesive |
Single |
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