Products / Thermal Interface Materials / Gap Filler Pads / Sheets / High Performance Silicone Thermal Interface Material, 3.5W/m.K
High Performance Silicone Thermal Interface Material, 3.5W/m.K
GCSP-35
Features
- Very good thermal conductivity
- Single side adhesive
- Long term stability
- Electrical insulation
Specifications
| Thermal conductivity W/m.K |
3.5 |
| Hardness |
35 |
| Thickness mm |
0.3-5.0 |
| Single / Double side adhesive |
Single |
Request information Data sheet
