Products / Thermal Interface Materials / Gap Filler Pads / Sheets / Low Density Silicone Thermal Interface Pad, 1.0W/m.K
Low Density Silicone Thermal Interface Pad, 1.0W/m.K
GCSP-10LD
Features
- Low density, ideal for weight limited applications
- 1.0 W/m K thermal conductivity< /li>
- With single side adhesive
- Long term stability
- >10 kV breakdown voltage
- ROHS/REACH compliant
Specifications
| Thermal conductivity W/m.K |
1 |
| Hardness |
30 |
| Thickness mm |
0.3-5.0 |
| Single / Double side adhesive |
Single |
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