Products / Thermal Interface Materials / Gap Filler Pads / Sheets / Low Density Silicone Thermal Interface Pad, 1.5W/m.K
Low Density Silicone Thermal Interface Pad, 1.5W/m.K
GCSP-15LD
Features
- Low density, ideal for weight limited applications
- 1.5 W/m K thermal conductivity
- With single side adhesive
- Long term stability
- >10 kV breakdown voltage
- ROHS/REACH compliant
Specifications
| Thermal conductivity W/m.K |
1.5 |
| Hardness |
40 |
| Thickness mm |
0.3-5.0 |
| Single / Double side adhesive |
Single |
Request information Data sheet
